TSMC, Intel, and Samsung announced on May 6 that they will jointly push for the development of next-generation 450mm, or 18-inch, semiconductor wafers. The three industry leaders have reached an agreement that the worldwide semiconductor industry should migrate to 450mm wafer production starting in 2012, EE Times reported. Furthermore, the three companies are expected to continue cooperation with the ISMI (International Sematech Manufacturing Initiative) consortium to establish common standards for the worldwide semiconductor industry.

At the same time, TSMC expects to invest up to US$5.0 billion in building its first 450mm wafer fabrication plant in Hsinchu, Taiwan. Construction is projected to commence in 2010, according to Taiwan's Economic Daily News.